| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element which minimizes the generation of sidewall pits, has excellent adhesion and excellent resolution, and can form a resist pattern having a good resist profile free of side indentation. <P>SOLUTION: The photosensitive element includes a support film 10 and a photosensitive layer 20 comprising a photosensitive resin composition formed on the support film 10, wherein the support film 10 has a haze of 0.01-1.5% and the photosensitive layer 20 contains (A) a carboxyl group-containing binder polymer, (B) a photopolymerizable compound having a polymerizable ethylenically unsaturated bond within a molecule, (C) a photopolymerization initiator, and (D) an adhesion providing agent. The photosensitive layer 20 contains a 2,4,5-triarylimidazole dimer as the photopolymerization initiator (C) and (a) an aliphatic carboxylic acid compound and/or a carboxylic acid compound having two or more carboxyl groups within a molecule as the adhesion providing agent (D). <P>COPYRIGHT: (C)2009,JPO&INPIT |
