| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce noise arising through through-holes. <P>SOLUTION: A multilayer circuit board includes a multilayer circuit part and a metal substrate 20 where a conductive layer and an insulation layer are laminated alternately by sandwiching the insulation layer 15 by respective conductive layers from a first conductive layer 11 to a fourth conductive layer 14, and the through-holes 301-303 that are interlayer connection holes formed in a thickness direction of each conductive layer and insulation layer 15 are formed at the multilayer circuit part. The through-hole 302 among them is terminated by a substrate embedding resistor 311 and the through-hole 303 is terminated by a substrate embedding resistor 312 and an adjustment pattern 111 so as to obtain impedance matching, thus preventing a signal propagated to an unneeded part of the through-holes 302, 303 from being radiated as electromagnetic waves and hence reducing electromagnetic interference (EMI) and suppressing the occurrence of noise. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
