发明名称 SUPPORT FOR USE OF FRAGILE MEMBER, AND TREATMENT METHOD OF THE FRAGILE MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a fragile member support capable of stably carrying a fragile member such as a semiconductor wafer and transferring the member to a subsequent process without damaging it after required treatment is completed when conveying the fragile material or machining the wafer such as polishing the rear face. SOLUTION: The fragile member support used to carry the fragile member in treating the member includes: a surface protective sheet including an aperture having a diameter smaller than an outer diameter of the fragile member to be carried and not having an adhesive layer formed and an adhesive layer for surrounding the aperture; and a rigid plate stuck to a surface of the sheet where the adhesive layer is not formed. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009188010(A) 申请公布日期 2009.08.20
申请号 JP20080023732 申请日期 2008.02.04
申请人 LINTEC CORP 发明人 OKUCHI SHIGETO;YAMAZAKI OSAMU;KUBOTA ARATA
分类号 H01L21/02;H01L21/304;H01L21/683 主分类号 H01L21/02
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