发明名称 |
SUPPORT FOR USE OF FRAGILE MEMBER, AND TREATMENT METHOD OF THE FRAGILE MEMBER |
摘要 |
PROBLEM TO BE SOLVED: To provide a fragile member support capable of stably carrying a fragile member such as a semiconductor wafer and transferring the member to a subsequent process without damaging it after required treatment is completed when conveying the fragile material or machining the wafer such as polishing the rear face. SOLUTION: The fragile member support used to carry the fragile member in treating the member includes: a surface protective sheet including an aperture having a diameter smaller than an outer diameter of the fragile member to be carried and not having an adhesive layer formed and an adhesive layer for surrounding the aperture; and a rigid plate stuck to a surface of the sheet where the adhesive layer is not formed. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009188010(A) |
申请公布日期 |
2009.08.20 |
申请号 |
JP20080023732 |
申请日期 |
2008.02.04 |
申请人 |
LINTEC CORP |
发明人 |
OKUCHI SHIGETO;YAMAZAKI OSAMU;KUBOTA ARATA |
分类号 |
H01L21/02;H01L21/304;H01L21/683 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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