发明名称 CONTINUOUS POLISHING DEVICE AND CONTINUOUS POLISHING METHOD OF TRAVELING SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a continuous polishing device capable of preventing clogging of a polishing pad and improving polishing efficiency. <P>SOLUTION: In the polishing device for continuously polishing a traveling substrate using a polishing head rotating around a rotary shaft, a supply hole for supplying polishing liquid is provided at a central part of the polishing head along the rotary shaft, the polishing pad, which does not have a through-hole and into which the polishing liquid penetrates, is closely adhered on the entire surface of the bottom part of the polishing head, and a pad side edge part is fixed to a peripheral part of the polishing head. The continuous polishing method using the continuous polishing device is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009184093(A) 申请公布日期 2009.08.20
申请号 JP20080029292 申请日期 2008.02.08
申请人 MITSUBISHI RAYON CO LTD 发明人 OBATA HIROSHI;FUNAMI EITA;OKUTSU HAJIME
分类号 B24B55/02;B24B7/12;B24B29/00 主分类号 B24B55/02
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