| 摘要 |
PROBLEM TO BE SOLVED: To provide a method such that workpieces provided with conductive balls can be manufactured in good yield in which minute particles of solder balls, gold balls, copper balls or the like, used in mounting a semiconductor device or an optical device on a substrate, are arranged accurately and highly reliably with respect to workpieces such as wafers etc. in accordance with a desired pattern. SOLUTION: A mask 45 includes a pattern of openings 46 for arranging conductive balls 48 in given positions of a wafer 10. The method has steps of: positionally matching a mask 45 and the wafer 10; filling the conductive balls 48 in a pattern of openings 46 of the mask 45; and removing the conductive balls 48d, which are packed in the opening patterns 46 of the mask 45, and/or conductive balls 48c, which are attached to the back surface 45b of the mask 45, from the backside of the mask 45 after separating the mask 45 and the wafer 10. COPYRIGHT: (C)2009,JPO&INPIT |
