发明名称 |
HYDROPHOBIC CONVERSION PROCESSING METHOD, HYDROPHOBIC CONVERSION PROCESSING UNIT, COATING-DEVELOPING APPARATUS, AND STORAGE MEDIUM |
摘要 |
<p>A hydrophobic processing method, a hydrophobic processing apparatus, a coating-developing device, and a recoding medium are provided to suppress a defect of a pattern by performing a hydrophobic conversion for improving the close adhesion between a base layer and a resist layer. A wafer is loaded on a loading unit(5) installed in a process space(20) inside a process container(30). The wafer loaded on the loading table is controlled to a first temperature in which the hydrophobic process gas is not condensed. The hydrophobic process gas is supplied to the temperature controlled wafer. The wafer surface becomes hydrophobic by reacting the molecule included in the hydrophobic process gas with the wafer surface. The wafer is controlled to the second temperature higher than the first temperature. The remaining molecule is removed from the wafer surface by exhausting the process space.</p> |
申请公布号 |
KR20090088808(A) |
申请公布日期 |
2009.08.20 |
申请号 |
KR20090011662 |
申请日期 |
2009.02.13 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
FUKUOKA TETSUO;KITANO TAKAHIRO |
分类号 |
H01L21/324;H01L21/02;H01L21/027 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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