| 摘要 |
PROBLEM TO BE SOLVED: To provide a feed mechanism for copper plating solution excellent in practicality, which can prevent enlargement of the whole plating apparatus due to the necessity of a concentration adjustment tank and does not use an ion exchange membrane having a low mechanical strength. SOLUTION: The feed mechanism 2 for copper plating solution has a copper ion dissolving tank 20 in which a copper ion is dissolved in a copper sulfate plating solution flowing from a copper plating tank 1. The copper sulfate plating solution having an increased copper ion concentration is allowed to flow into the copper plating tank. In the copper ion dissolving tank, there are provided an anode chamber 22 in which the copper sulfate plating solution flowing from the copper plating tank is stored and a cathode chamber 21 in which an electrolyte solution is stored, these chambers being provided adjacent to each other through at least 2 or more cation exchange membranes 6 and 7. The anode chamber has a soluble copper anode 23 which is immersed in the copper sulfate plating solution and dissolved therein by energization, and the cathode chamber has a cathode 24 immersed in the electrolyte solution. The cation exchange membranes are disposed with the surfaces thereof opposing to each other with a gap therebetween. COPYRIGHT: (C)2009,JPO&INPIT
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