发明名称 RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a release film making and holding both of destaticizing performance which cannot be revealed in the conventional polyester film while basic request characteristics, such as finishing outside, metal-plating properties, etc. of a printed circuit board in a thermal pressing step when manufacturing the printed circuit board and mold releasing properties excellent in printed circuit board material. SOLUTION: The release film has a polyester film having an applying layer on at least one side surface in which the surface specific resistance value of the applying layer surface is a range of 1×10<SP>7</SP>to 1×10<SP>12</SP>Ω, and a water droplet contact angle of a range of 70 to 120°. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009184331(A) 申请公布日期 2009.08.20
申请号 JP20080029809 申请日期 2008.02.09
申请人 MITSUBISHI PLASTICS INC 发明人 HIBIYA TAKASHI
分类号 B32B27/36;B32B27/00 主分类号 B32B27/36
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