发明名称 RF MODULE
摘要 In a radio-frequency wave module including a transmission path based on a distributed parameter element, the transmission path being part of an input/output terminal, a plurality of cavity-structured concave portions for containing semiconductor-including mounted components therein, grounding-use metallic electrodes, dielectric substrates of at least two or more layers, and semiconductors, electrical separation is established between the grounding-use metallic electrodes which form the transmission paths based on the distributed parameter element and at least one of the grounding-use metallic electrodes which are formed on bottom surfaces of the plurality of cavity-structured concave portions for containing the semiconductor-including mounted components therein.
申请公布号 US2009206959(A1) 申请公布日期 2009.08.20
申请号 US20090366933 申请日期 2009.02.06
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 HASE EIICHI
分类号 H01P1/00 主分类号 H01P1/00
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