发明名称 HONEYCOMB STRUCTURE
摘要 <p>A honeycomb structure of high thermal shock resistance capable of preventing any breakage by thermal stress. The honeycomb structure is one having multiple columnar honeycomb fired bodies each having a multiplicity of cells arranged in parallel relationship in the longitudinal direction thereof with cell walls interposed therebetween, the multiple columnar honeycomb fired bodies bonded together via adhesive layers, characterized in that the honeycomb fired bodies consist of central honeycomb fired bodies positioned in the central part of cut surface resulting from cutting of the honeycomb structure by a cross section perpendicular to the longitudinal direction thereof and peripheral honeycomb fired bodies constituting portions of the periphery of the cut surface, and that at least one of the peripheral honeycomb fired bodies is a peripheral small honeycomb fired body having a cross-sectional area at the cut surface which is below 60% of the cross-sectional area of one of the central honeycomb fired bodies, and that a peripheral honeycomb bonded body composed of, bonded together by adhesive layer (B), the peripheral small honeycomb fired body and at least one other honeycomb fired body has a cross-sectional area at the cut surface which is at least 60% of the cross-sectional area of one of the central honeycomb fired bodies, and that when the adhesive layer for bonding central honeycomb fired bodies to each other is referred to as adhesive layer (A), the thermal conductivity and Young's modulus of the above adhesive layer (B) are higher than those of the adhesive layer (A).</p>
申请公布号 WO2009101691(A1) 申请公布日期 2009.08.20
申请号 WO2008JP52418 申请日期 2008.02.14
申请人 IBIDEN CO., LTD.;OHNO, KAZUSHIGE;OKUDA, MASATOSHI 发明人 OHNO, KAZUSHIGE;OKUDA, MASATOSHI
分类号 B01D39/20 主分类号 B01D39/20
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