发明名称 LASER PROCESSING MACHINE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser processing machine having a cutting guide function. <P>SOLUTION: The laser processing machine 10 includes a laser mechanism 20, a guide unit 30 and an ultrasonic means 40. The laser mechanism 20 is can generating a laser beam which irradiates a workpiece 12 along a path. The guide unit 30 is arranged adjacent to the laser mechanism 20. The ultrasonic means 40 is cangenerating an ultrasonic wave to be transferred to the workpiece 12 along the path by the guide unit 30. By means of the double-processing effect of the ultrasonic wave and the laser beam, the invention achieves the objects of high cutting precision, excellent product quality and fast processing speed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009184010(A) 申请公布日期 2009.08.20
申请号 JP20080038297 申请日期 2008.02.20
申请人 CONTREL TECHNOLOGY CO LTD 发明人 KAKU KARYU;CHEN YAN-HUA
分类号 B23K26/38;B23K26/16;B23K26/40;B23K101/40;C03B33/09;G02F1/13 主分类号 B23K26/38
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