| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid treatment apparatus evenly dipping a treatment liquid among treating objects. SOLUTION: The liquid treatment apparatus applying a chemical reaction treatment to a cover film 21 by dipping stripping liquid 51 to the cover film 21 on a substrate 20, is provided with rollers 30 conveying the substrate 20, first shower heads 50 spraying the stripping liquid 51, and baffle plates 40 installed between the shower heads 50 and the rollers 30 and preventing direct spray of the stripping liquid 51 to the substrate 20. This configuration can prevent direct spray of the stripping liquid 51 sprayed from the first shower heads 50 to the cover film 21 on the surface of the substrate 20, to suppress flow of the stripping liquid 51 on the surface of the substrate 20, to evenly spread the stripping liquid 51 to all over the surface of the substrate 20, and to thereby swell and strip the entire cover film 21. COPYRIGHT: (C)2009,JPO&INPIT
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