发明名称 DICING DIE-BONDING FILM
摘要 The present invention provides a dicing die-bonding film including a dicing film having a pressure sensitive adhesive layer provided on a base material and a die-bonding film provided on the pressure sensitive adhesive layer, and having excellent storage stability of a product even at room temperature. The dicing die-bonding film in the present invention is a dicing die-bonding film having a dicing film including a radiation curable pressure sensitive adhesive layer provided onto a base material and a die-bonding film provided on the pressure sensitive adhesive layer, in which a pressure sensitive adhesive in the pressure sensitive adhesive layer is constituted by containing an acryl polymer, and in which the acid value of the acryl polymer is in a range of 0.01 to 1 and the iodine value is in a range of 5 to 10.
申请公布号 US2009209089(A1) 申请公布日期 2009.08.20
申请号 US20090372590 申请日期 2009.02.17
申请人 发明人 MURATA SHUUHEI;MATSUMURA TAKESHI;KAMIYA KATSUHIKO
分类号 H01L21/00 主分类号 H01L21/00
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