发明名称 |
BONDING PAD FOR ELECTRONIC SUBASSEMBLIES |
摘要 |
A method for installing a bonding pad as a gasket for an electronic subassembly includes providing a bonding pad comprising an expandable foam; an air-tight bladder covering at least one side of the expandable foam; a layer of conductive material covering the air-tight bladder and comprising at least one contact point; and an open port; removing air from the air-tight bladder, thereby compressing the expandable foam; installing the bonding pad into a gap between two surfaces; allowing the compressed foam to expand under atmospheric pressure; and electrically bonding the two surfaces with the bonding pad.
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申请公布号 |
US2009205780(A1) |
申请公布日期 |
2009.08.20 |
申请号 |
US20080032874 |
申请日期 |
2008.02.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINE CORPORATION |
发明人 |
FREDERICKSEN ROSS THOMAS;GILLILAND DON ALAN |
分类号 |
B29C65/00 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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