APPARATUS AND METHOD FOR SOLDER BALL FILING

摘要

There is disclosed a solder ball filling apparatus. The apparatus includes a base plate capable of pivoting between a first pivot direction and a second pivot direction opposite to the first pivot direction. A ball grid array template is also provided on the base plate. The ball grid array template has a plurality of locating holes extending through the base plate for receiving solder balls therein. A solder ball supply bin is also provided having a pair of moveable gates oppositely disposed to each other and respectively connected by a pair of sidewalls to define an enclosure therebetween for holding the solder balls. In use, the solder ball supply bin is mounted on and is moveable along the base plate as the base plate pivots between respective first and second directions to enable the solder ball supply bin to pass over the ball grid array template and deposit the balls in the locating holes of the ball grid array template. The pair of moveable gates are arranged to pass over the ball grid array and move upon contact with a solder ball that at least partially extends from the locating holes.