COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN, METHOD OF FORMING PATTERN AND SEMICONDUCTOR DEVICE

摘要

A positive photosensitive resin composition is provided to ensure high-sensitivity, excellent coating uniformity and resolution, and to minimize scum generation and shrinkage in crosslinkage. A positive photosensitive resin composition comprises a polyamide derivative 100.0 parts by weight; a photosensitive compound 5 -30 parts by weight; at least additive 0.5-20 parts by weight selected from additives represented by chemical formulas (I)-(IV). In chemical formula II, n is an integer of 2-6. In chemical formula III, R^8 and R^9 are respectively independent and represents hydrogen atom or C1-10 alkoxy group; and R^10 is C1-20 alkyl group or aryl group.