| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer chip element, capable of solving the problem of residues in exposure and development, even if the content of photosensitive resin component in a photosensitive conductor paste is reduced. SOLUTION: In this method, a lower layer of a photosensitive conductor paste 24 is a second dielectric layer 20 obtained by exposing and curing the photosensitive dielectric paste 10 in development processing for cleaning out an unexposed portion in the photosensitive paste 24. Thus, the residues can be reduced significantly, and even if the resin component of the photosensitive conductor paste 24 is reduced at 10 wt.% or lower, the exposure and development are not influenced and a dry densityρ<SB>D</SB>is still 5 g/cm<SP>3</SP>or higher, as in a conventional conductor paste; and a fully dense conductor is obtained. COPYRIGHT: (C)2009,JPO&INPIT |
