发明名称 PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which is advantageous in microscopic wiring formation, electrical characteristics and manufacturing cost, and is further reliable, and is excellent in high-frequency properties. SOLUTION: This printed wiring board is composed of a conductive circuit and an insulating layer, wherein a part of the conductive circuit is formed of a metallic foil, a ten-point average roughness (Rz) in an inner layer side of the conductive circuit is 2μm or less, and the insulating layer is constituted so as to include at least two or more layers of an adhesion layer and a bulk layer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009188429(A) 申请公布日期 2009.08.20
申请号 JP20090125160 申请日期 2009.05.25
申请人 HITACHI CHEM CO LTD 发明人 TAKAI KENJI;MASUDA KATSUYUKI;HASEGAWA KIYOSHI;MORIIKE MICHIO;KAMIYAMA KENICHI
分类号 H05K1/03;H05K3/38 主分类号 H05K1/03
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