| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for improving external appearance inspection speed of cross-shaped region on the front surface of a semiconductor wafer in the external appearance inspection for detecting a fault through comparison of images for each die by scanning a semiconductor wafer with an imaging apparatus to acquire a front surface image. SOLUTION: The external appearance inspection apparatus 1 includes: a rotatable sample tray 12 for setting the semiconductor wafer 2; and a stage 11 for moving the semiconductor wafer 2 at least in the X-direction. The external appearance inspection apparatus includes an inspection mode for acquiring an image of the cross-shaped region on the semiconductor wafer 2 and comparing images in the cross-shaped region by moving the stage 11 in the X-direction and scanning the semiconductor wafer 2 with an imaging section 14 in the respective timings before and after rotation of the sample tray 12 for 90 degrees. COPYRIGHT: (C)2009,JPO&INPIT
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