| 摘要 |
A degradation in throughput is prevented even in cases where it is necessary to reduce a pixel size during inspection according to a finer circuit pattern. In an inspection method and an inspection apparatus in which an inspected sample having a circuit pattern is irradiated with a charged particle beam to generate a signal, an image is obtained from the signal, and in which a defect of the circuit pattern is detected from the image, the inspection is performed while an inspected pixel size in a direction in which the charged particle beam is scanned relative to the inspected sample and an inspected pixel size in a stage moving direction are separately set. The stage is moved while the inspected sample is placed thereon.
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