| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip and its manufacturing method securing high responsibility, wherein the peeling of the semiconductor chip from a sealing insulating resin can be suppressed even in the case of a large chip size. <P>SOLUTION: A semiconductor device has a stress relieving layer on its surface on the back side of a circuit forming surface of a semiconductor chip. The stress relieving layer comprises a polymer selected from polyimide, benzocyclobutene, fluorinated polyimide and porous PTFE. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
