| 摘要 |
PROBLEM TO BE SOLVED: To provide a DUT substrate cooling system for cooling a DUT substrate. SOLUTION: This DUT substrate cooling system disposed in the DUT substrate mounted on the test head includes a cooling channel disposed in the DUT substrate 13, and a cooling fluid supply means for receiving supply of cooling fluid used by the test head from the test head 11 when the DUT substrate is communicated with the cooling channel and is mounted on the test head 11. COPYRIGHT: (C)2009,JPO&INPIT
|
