| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board where wiring is disposed to reduce inductance. SOLUTION: Ground wiring 22 and power supply wiring 33 provided in the multilayer circuit board 100 are arranged so that they mostly overlap vertically along a longitudinal direction of a substrate and their currents flow through the overlapped part in opposite directions mutually, thus mutually canceling a generated magnetic field. Similarly, W-phase wiring 11, V-phase wiring 21, and U-phase wiring 31 are also arranged so that they partially overlap vertically along a longitudinal direction, and magnetic fields generated by currents flowing through the vertically overlapped part cancel each other. Therefore, by increasing the mutual inductance between the wires, the inductance of the wires can be reduced. COPYRIGHT: (C)2009,JPO&INPIT
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