发明名称 CURABLE RESIN COMPOSITION AND CURED RESIN
摘要 <p>Disclosed is a curable epoxy resin composition which has excellent toughness and is thus hardly fractured, and exhibits good adhesion to other materials, while maintaining excellent heat resistance and elastic modulus intrinsic to epoxy resins. In addition, the curable epoxy resin composition has excellent weather resistance, solvent resistance and the like. The curable epoxy resin composition contains 1-70 parts of an epoxy resin curing agent and 1-50 parts of an acrylic block copolymer per 100 parts of an epoxy resin. The acrylic block copolymer contains one or more polymer blocks A composed of a structural unit derived from an alkyl methacrylate ester and one or more polymer blocks B composed of a structural unit derived from an alkyl acrylate ester, while having a weight average molecular weight (Mw) of 30,000-300,000, a molecular weight distribution (Mw/Mn) of not more than 1.5, and a content ratio of the polymer blocks A of 3-60% by mass. A cured resin composed of the curable epoxy resin composition is also disclosed.</p>
申请公布号 WO2009101961(A1) 申请公布日期 2009.08.20
申请号 WO2009JP52280 申请日期 2009.02.12
申请人 KURARAY CO., LTD.;HYOGO;KISHI, HAJIME;KUNIMITSU, YUMI;IMADE, JIN;OSHITA, SHINYA;MORISHITA, YOSHIHIRO;ASADA, MITSUNORI 发明人 KISHI, HAJIME;KUNIMITSU, YUMI;IMADE, JIN;OSHITA, SHINYA;MORISHITA, YOSHIHIRO;ASADA, MITSUNORI
分类号 C08L63/00;C08G59/24;C08G59/62 主分类号 C08L63/00
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