| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which can be made compact and has high connection reliability without greatly altering an electronic component mounting stage by conventional BGA (Ball Grid Array) mounting in a technique for controlling the gap between an electronic component package and a mounting substrate. SOLUTION: The electronic component has the electronic component package and mounting substrate connected by a plurality of solder bumps, wherein some of the plurality of solder bumps are formed of a core solder ball formed by coating a surface of a ball which has a higher fusion point than solder and serves as a core with the solder. The core solder balls support the mounting substrate at least at three points not on the same one straight line. COPYRIGHT: (C)2009,JPO&INPIT
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