发明名称 SUBSTRATE PLACING TABLE, SUBSTRATE PROCESSING APPARATUS, AND TEMPERATURE CONTROL METHOD FOR SUBSTRATE TO BE PROCESSED
摘要 PROBLEM TO BE SOLVED: To provide a means of making the temperature of the whole substrate uniform by compensating for heat conduction of a part which is inferior in heat conduction since the circumference of a power feeder to an electrostatic chuck electrode is enclosed with an insulating material in a substrate placing table equipped with the electrostatic chuck and then the part which is inferior in heat conductor is formed. SOLUTION: An annular projection portion is formed on the surface of a substrate placing table surface at the circumference of the power feeder to define the space of the gap between the substrate and mounting table into an inner region and an outer region, a supply pipe and a discharge pipe for cooling gas are disposed in the respective regions to independently control cooling gas pressures in the respective regions. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009188162(A) 申请公布日期 2009.08.20
申请号 JP20080026235 申请日期 2008.02.06
申请人 TOKYO ELECTRON LTD 发明人 SASAKI YASUHARU
分类号 H01L21/683;H01L21/3065 主分类号 H01L21/683
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