| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning device for efficiently cleaning foreign matters stuck to a surface of a wafer, on which a weak and minute pattern is formed, without destroying the pattern. SOLUTION: Cleaning fluid is continuously supplied on the surface of the wafer through a gap formed of a circumferential side of a cylindrical supersonic oscillating body and a cylindrical enclosure; a fluid is branched into a flow component flowing to a supersonic irradiation region, into a gap between the surface of the wafer and the oscillating body, and a flow component flowing outside the enclosure; the cleaning fluid component flowing to the gap between the oscillating body and the wafer, into which the foreign matters are mixed in supersonic cleaning, is sucked from a passage formed along a center axis of an oscillating body column, and it is discharged outside a cleaning system of the single wafer-type ultrasonic spin cleaning device of a supersonic oscillating body type. Thus, the ultrasonic cleaning device preventing the foreign matters separated by an ultrasonic wave from being stuck again to the surface of the wafer and desired cleanliness is obtained, in a short time with high cleaning efficiency. COPYRIGHT: (C)2009,JPO&INPIT
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