发明名称 RESIN COMPOSITION AND FLEXIBLE WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in insulation reliability and screen printing property under the conditions of high temperature and high humidity; and to provide a flexible wiring board using the resin composition. SOLUTION: The resin composition comprises (A) component: a resin including a polycarbonate skeleton, (B) component: metalhydroxide, (C) component: talc, (D) component: solvent, and (E) component: an ion exchanger, wherein the content of the (B) component is 20-100 parts by weight relative to 100 parts by weight of the (A) component, and the content of the (C) component is 20-100 parts by weight relative to 100 parts by weight of the (A) component. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009185200(A) 申请公布日期 2009.08.20
申请号 JP20080027595 申请日期 2008.02.07
申请人 HITACHI CHEM CO LTD 发明人 HAYASHI HIROYUKI;HIRATA TOMOHIRO
分类号 C08L75/04;C08K3/22;C08K3/34;C08L77/00;C08L79/08;H05K1/03;H05K3/28 主分类号 C08L75/04
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