| 摘要 |
PROBLEM TO BE SOLVED: To provide a relatively small-sized speaker device which reduces stresses on a bonding part of a peak portion (fold-out portion) of a diaphragm and a damper with relatively simple configuration, suppresses releasing at the bonding part of the diaphragm and the damper, and suppresses the noise caused by contact of the diaphragm and the damper. SOLUTION: A speaker device 100 includes a diaphragm 8, a magnetic circuit 4, and a damper 10, which is formed, in such a shape that an inner edge 8A is connected to a voice coil bobbin 6; an outer edge 8B is connected through an edge 9 to a frame 5; a peak portion (fold-out portion 8C) is formed between the inner edge 8A and the outer edge 8B; and the inner edge 8A and the outer edge 8B are positioned on an acoustic radiation side, in comparison with the fold-out portion 8C; and the magnetic circuit drives a voice coil 7 disposed in the voice coil bobbin 6. In the damper, an outer edge 10A is connected to the frame 5, one end portion at an inner peripheral side is formed in a groove shape, folded back according to the shape of the fold-out portion 8C of the diaphragm 8 and the fold-out portion 8C of the diaphragm 8 is supported. COPYRIGHT: (C)2009,JPO&INPIT
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