| 摘要 |
The invention relates to a substrate for semiconductor elements, which contains at least one heat-conducting base of an electrically conductive at least partially metallic material. The aim of the invention is to increase the adhesive strength of an electrically insulating coating for a conductor to the base, said conductor extending from a top to a bottom of the base. The invention is characterized in that a continuous adhesion-promoting layer is provided between the electrically insulating coating and the base, said layer containing at least one refractory metal or a refractory metal compound. |
