发明名称 |
METHOD FOR MANUFACTURING MICROCHIP AND MICROCHIP |
摘要 |
<p>Provided is a microchip with increased joint strength between resinous substrates each provided with a recessed and protruding member on the surface thereof. A channel groove is formed in the surface of a resinous substrate (10), and a through-hole is formed at an end portion of a microchannel. A protruding portion (14) protruding in the thickness direction of the resinous substrate (10) is provided to surround the through-hole on the surface on the side opposite to the surface in which the channel groove is formed. A resinous substrate (20) is almost octagon shaped and smaller than the resinous substrate (10). A microchip is manufactured by joining the resinous substrate (10) and the resinous substrate (20) with the channel groove facing inward. By forming the resinous substrate (20) in an almost octagon shape, the resinous substrates are joined in a region other than the surface near the corners of the resinous substrate (10).</p> |
申请公布号 |
WO2009101850(A1) |
申请公布日期 |
2009.08.20 |
申请号 |
WO2009JP51070 |
申请日期 |
2009.01.23 |
申请人 |
KONICA MINOLTA OPTO, INC.;SHIMIZU, NAOKI |
发明人 |
SHIMIZU, NAOKI |
分类号 |
G01N35/08;B29C65/02;G01N27/447 |
主分类号 |
G01N35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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