发明名称 METHOD FOR MANUFACTURING MICROCHIP AND MICROCHIP
摘要 <p>Provided is a microchip with increased joint strength between resinous substrates each provided with a recessed and protruding member on the surface thereof. A channel groove is formed in the surface of a resinous substrate (10), and a through-hole is formed at an end portion of a microchannel. A protruding portion (14) protruding in the thickness direction of the resinous substrate (10) is provided to surround the through-hole on the surface on the side opposite to the surface in which the channel groove is formed. A resinous substrate (20) is almost octagon shaped and smaller than the resinous substrate (10). A microchip is manufactured by joining the resinous substrate (10) and the resinous substrate (20) with the channel groove facing inward. By forming the resinous substrate (20) in an almost octagon shape, the resinous substrates are joined in a region other than the surface near the corners of the resinous substrate (10).</p>
申请公布号 WO2009101850(A1) 申请公布日期 2009.08.20
申请号 WO2009JP51070 申请日期 2009.01.23
申请人 KONICA MINOLTA OPTO, INC.;SHIMIZU, NAOKI 发明人 SHIMIZU, NAOKI
分类号 G01N35/08;B29C65/02;G01N27/447 主分类号 G01N35/08
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