| 摘要 |
A stack package is provided to prevent an electrical fail and a short circuit between wires by forming a bonding wire through a tape for fixing a wire. A first semiconductor chip(106) is attached on a substrate(102). A first bonding wire(112) electrically connects the first semiconductor chip to the substrate. At least one or more second semiconductor chips(108) are attached on the first semiconductor chip. A second bonding wire(114) electrically connects the second semiconductor chip to the substrate. A tape(118) for fixing a wire is formed in order to fix at least one among the first bonding wire and the second bonding wire. A sealing material seals one surface of the substrate including the first semiconductor chip, the second semiconductor chip, the first bonding wire, the second bonding wire, and the tape. |
