发明名称 |
METHOD FOR BONDING RESIN MATERIALS CONTAINING OXYMETHYLENE POLYMER AND STRUCTURES |
摘要 |
Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes preparing as the resin material (Y) a low-melting-point oxymethylene-based polymer (B) having a melting point lower than that of the oxymethylene-based polymer (A) by 5 to 50°C, or preparing as the resin material (Y) the resin material (X) or another resin material, and providing the low-melting-point oxymethylene-based polymer (B) between the resin material (Y) and the resin material (X) and heating resin materials. |
申请公布号 |
EP2090630(A1) |
申请公布日期 |
2009.08.19 |
申请号 |
EP20070832963 |
申请日期 |
2007.12.03 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
OKAMURA, AKIRA;NAGAI, SATOSHI |
分类号 |
C09J5/06;B29C65/40;B29K59/00;C09J159/04 |
主分类号 |
C09J5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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