Method for manufacturing a semiconductor laser and semiconductor laser

摘要

The method involves preparing a supporting disk made of ceramic material, and producing wafer interconnections (40) by a set of semiconductor laser chips (4) on an upper surface of the supporting disk. The interconnections are isolated by a set of semiconductor lasers (100) that includes a mounting block (3) with a mounting surface, which runs perpendicular to an upper surface (12) of the mounting block. One of the chips is arranged on the upper surface of the mounting block, where the mounting surface is manufactured during the isolation of the interconnections. An independent claim is also included for a semiconductor laser comprising a mounting block.