发明名称 |
HEAT DISSIPATION SYSTEM FOR PHOTOVOLTAIC ARRAY INTERCONNECTION SYTEM |
摘要 |
<p>A heat dissipation system for a photovoltaic array (PV) interconnection system includes an enclosure containing one or more diode elements. A heat pipe system has heat sinks attached to one or both ends. The heat pipe passes through the enclosure in thermal contact with the diode assemblies. Cooling fins are arranged on the heat sink such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the enclosure to cool the components within the enclosure.</p> |
申请公布号 |
EP2089911(A1) |
申请公布日期 |
2009.08.19 |
申请号 |
EP20070840086 |
申请日期 |
2007.11.21 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
DUESTERHOEFT, SCOTT STEPHEN |
分类号 |
H01L31/024;H01L23/36;H01L31/048 |
主分类号 |
H01L31/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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