发明名称 PART MOUNTING APPARATUS AND PART MOUNTING METHOD
摘要 <p>The present invention is intended for providing a component mounting apparatus and a component mounting method which improve an accuracy and a rate of placement of components on a circuit-formed member. A component 1 sucked by a suction nozzle 5 is recognized at a component recognizing position 10, a deviation DELTA L of the component 1 from a normal suction status 1b is determined on basis of component recognition information obtained from the recognition of the component, and a velocity of conveyance of the component 1 for a period of time following the recognition of the component and preceding the placement of the component is controlled on basis of a magnitude of the deviation. By the control, the accuracy and rate of placement of the components 1 on the circuit-formed member 2 can be improved. <IMAGE></p>
申请公布号 EP1545181(B1) 申请公布日期 2009.08.19
申请号 EP20020772868 申请日期 2002.09.20
申请人 PANASONIC CORPORATION 发明人 SAKAI, KAZUNOBU;NAKASHIMA, MAKOTO;HIRAI, WATARU;ISHITANI,YASUYUKI
分类号 H05K13/04;H01L21/50;H01L21/52;H05K13/08 主分类号 H05K13/04
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