| 发明名称 |
Process for bonding two substrates |
| 摘要 |
<p>The invention relates to a method for bonding two substrates, in particular two semiconductor substrates which, in order to be able to improve the reliability of the process, provides the step of providing a gaseous flow over the bonding surfaces of the substrates. The invention also relates to a corresponding bonding equipment.</p> |
| 申请公布号 |
EP2091071(A1) |
申请公布日期 |
2009.08.19 |
| 申请号 |
EP20080290150 |
申请日期 |
2008.02.15 |
| 申请人 |
S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES |
发明人 |
GAUDIN, GWELTAZ;LALLEMENT, FABRICE;COLNAT, CYRILLE;GIARD, PASCALE |
| 分类号 |
H01L21/18;H01L21/762 |
主分类号 |
H01L21/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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