发明名称 CYANIDE FREE ELECTROLYTE COMPOSITION UND PROCESS FOR PLATING SILVER OR ALLOYS THEREOF ON SUBSTRATES
摘要 <p>Cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate, comprises at least a silver ion source, sulfonic acid and/or its derivative, wetting agent and hydantoin (I). Cyanide-free electrolyte composition for depositing a silver or silver alloy layer on a substrate, comprises at least a silver ion source, sulfonic acid and/or its derivative, wetting agent and hydantoin of formula (I). R 1, R 2aryl (optionally substituted), H or 1-5C-alkyl. An independent claim is included for a method for separating silver- or silver alloy layer on a substrate comprising contacting the substrate to be coated in an adjusted current density of 0.1-2, preferably 0.3-1.5 A/dm 2>, with an electrolyte composition. [Image].</p>
申请公布号 EP2089561(A2) 申请公布日期 2009.08.19
申请号 EP20070818853 申请日期 2007.10.09
申请人 ENTHONE, INC. 发明人 SCHAEFER. STEFAN;RICHARDSON, THOMAS
分类号 C25D3/46 主分类号 C25D3/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利