发明名称 CUTTING TIP FOR DIAMOND TOOL AND DIAMOND TOOL
摘要 A cutting tip for a diamond tool and a diamond tool having the same which serve to cut or perforate various brittle materials such as stone, brick, concrete and asphalt. In particular, the cutting tip for a diamond tool and the diamond tool have diamond particles which are suitably arrayed to improve the cutting rate. A cutting tip for a diamond tool having diamond particles which are distributed in the cutting tip, wherein the diamond particles are inclined in respect to a cutting direction in a plane parallel to a cutting surface, and arrayed whereby grooved channels are formed successively overlapped on a brittle substance in cutting operation.
申请公布号 EP1480781(A4) 申请公布日期 2009.08.19
申请号 EP20030705432 申请日期 2003.02.07
申请人 EHWA DIAMOND IND. CO., LTD.;GENERAL TOOL, INC. 发明人 KIM, SOO-KWANG;KIM, JONG-HO;PARK, HEE-DONG
分类号 B24D3/00;B23D61/18;B23P5/00;B24D3/06;B24D5/06;B24D5/12;B28D1/04;B28D1/12 主分类号 B24D3/00
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