PB-FREE SOLDER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

摘要

A lead-free solder and a semiconductor package including the same are provided to obtain high resistance about the mechanical impact and thermal stress by including the silver above 3.5 wt% and the copper below the 0.5 wt%. A semiconductor package includes a first printed circuit board(102), a second printed circuit board(202), a lead free solder ball(103), and at least one semiconductor chip(101). The first printed circuit board includes a solder pad. The lead free solder ball is attached to the solder pad of the first printed circuit board. The lead free solder ball contains the silver of 3.5 to 6.0 wt%, the copper of 0.05 to 0.5w%, and the tin. The semiconductor chip is formed in the first printed circuit board. The second printed circuit board is electrically connected to the lead free solder ball.