| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently calibrate a surface position measuring unit that an aligner is equipped with. <P>SOLUTION: Disclosed is an exposure method for exposing a wafer W to a pattern using a projection optical system, the exposure method including the steps of: moving a wafer stage WST holding the wafer W between a loading position LP disposed apart in a Y direction and the projection optical system PL along a plane substantially parallel to a holding surface for the wafer W; measuring a Z-position distribution on a surface of an X-scale portion 39XA on the wafer stage WST by a multi-point AF system 90 and Z sensors 72a to 72d which measure a Z-position distribution of the wafer W; and calibrating the multi-point AF system 90 according to a measurement result thereof. <P>COPYRIGHT: (C)2009,JPO&INPIT |
