| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable light emitting device having excellent heat dissipation properties, in which one electrode and the other electrode of a light emitting element are solder-joined to package electrodes by using at least one metal member to allow a large current to pass through. <P>SOLUTION: A light emitting device includes: a package having at least two package electrodes; a light emitting diode; metal members that connect electrodes of the light emitting diode and the package electrodes; and a solder connecting between these constituents. The light emitting diode may be either an upper electrode type light emitting diode that has an n-type electrode and a p-type electrode on the upper surface thereof or an upper/lower electrode type light emitting diode. The electrodes of the light emitting diode are connected to the package electrodes by the metal members each interposed between one electrode and its corresponding package electrode. Between the package electrodes, the electrodes of the light emitting diode, and the metal members, the solder having a particle size of 3 to 20 μm is placed and melted by heating to join them to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT |
