| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate fitting structure capable of lowering the impedance of a specified inner-layer conductor pattern without adding a via. SOLUTION: The substrate fitting structure comprises a chassis 4 and a multilayer substrate 1 fixed on the chassis 4 with a screw. The multilayer substrate 1 has a plurality of insulating layers 11 to 15 which are laminated, and a plurality of conductor patterns 20 to 25 to form a ground layer or electric circuit are formed on top surfaces or/and back surfaces of a plurality of insulating layers including at least one insulating layer disposed as an inner layer among the plurality of insulating layers. A spot facing portion is recessed in the top or reverse surface of the multilayer substrate 1, the head 51 of the screw 5 is installed in the spot facing portion 16, and the screw body 52 of the screw 5 is screwed in the chassis 4, so that the head 51 of the screw 5 comes into contact with the conductor pattern 23 exposed on the bottom surface of the spot facing portion 16. COPYRIGHT: (C)2009,JPO&INPIT
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