发明名称 SUBSTRATE CONNECTION STRUCTURE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a substrate connection structure which includes a substrate and a flexible printed board such that wiring of the flexible printed board is hard to break, and to provide electronic equipment provided with the substrate connection structure. SOLUTION: The substrate connection structure includes the key substrate 50 having a key substrate-side conductive portion 57 formed, the flexible printed board 90 having an FPC-side conductive portion 91, and an anisotropic conductive film 100 disposed between the key substrate-side conductive portion 57 and FPC-side conductive portion 91 to constitute a connection portion 95. The flexible printed board 90 has a curved portion 94 curved so that an internal surface 90b becomes the inner side, and a projection portion 110 projecting more toward the first surface 50a of the key substrate 50 than toward a second surface 50b in the thickness D of the key substrate 50 is formed at the part of the curved portion 94 on the side of the connection portion 95. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009182002(A) 申请公布日期 2009.08.13
申请号 JP20080017379 申请日期 2008.01.29
申请人 KYOCERA CORP 发明人 ZAITSU MASAYUKI
分类号 H05K1/14 主分类号 H05K1/14
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