| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing package configured such that even if a substrate is curved, the substrate and a lid body can be easily bonded over the entire circumference. SOLUTION: The substrate 110 has a recessed portion 121, and a device is die-bonded to a bottom surface of the recessed portion 121. The substrate 110 includes a metal film 161 extended in a circumferential direction of a peripheral edge 125 of an opening end 122 of the recessed portion 121 disposed above the recessed portion 121. A glass lid 140 includes a metal film 162 extended in a circumferential direction of a side surface 143 thereof. The glass lid 140 is partially inserted into the recessed portion 121 to define a sealing space cooperatively with the substrate 110. The metal film 161 and metal film 162 are bonded together with a solder material 165. The metal film 161 is bonded to a portion of the metal film 162 positioned at least above a top surface of the metal film 161 with the solder material 165. COPYRIGHT: (C)2009,JPO&INPIT
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