发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board enabling a more stable electrical connection through a conductor in a through-hole. SOLUTION: The wiring board has a substrate 11 with the through-hole 11h and wiring conductors 14 formed around the two opening sections of the through-hole 11h respectively on the surface of the substrate 11. The wiring board further has a conductive member 13 having two end sections connected to the corresponding wiring conductors 14 while a part between the two end sections is inserted into the through-hole 11h and the surfaces of sections excepting the two end sections are separated from a base body 11. The two end sections of the conductive member 13 are separated in a plan view. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009181991(A) 申请公布日期 2009.08.13
申请号 JP20080017298 申请日期 2008.01.29
申请人 KYOCERA CORP 发明人 HASHIMOTO TOSHIHIRO
分类号 H05K1/11;H05K3/40 主分类号 H05K1/11
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