| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board whereby an insulating film can be surely formed, even if there are disconnected spots in wiring, and to provide a manufacturing method of an electronic element whereby the electronic element is formed on the circuit board, and the circuit board. SOLUTION: This circuit board 10 is equipped with a board 11, a plurality of wiring 12, a plurality of compensation wiring s13 to connect between a plurality of the wiring 12, and a power supply connecting part 14, to which a dc power supply is connected, when anodizing is carried out. A plurality of the wiring 12 are equipped with wiring conductor parts 12a formed by a valve metal, wiring insulating films 12b formed by anodizing the surface of the valve metal, respectively. A plurality of the compensation wiring 13 are equipped with compensation wiring conductor parts 13a, formed in regions between pixel regions 15 adjacent to each other and forme by the valve metal, and compensation wiring insulating films 13b formed by anodizing the surface of the valve metal, respectively. COPYRIGHT: (C)2009,JPO&INPIT |
