发明名称 FILM-FORMING APPARATUS AND FILM-FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film-forming apparatus and a film-forming method avoiding a displacement of a catalyst wire when electric current is supplied. SOLUTION: There are provided a film-forming stage holding a substrate S by setting up a film-forming face Sa of the substrate S, the catalyst wire 15 hung down so as to face the film-forming face Sa, and a power source for supplying electric current to the catalyst wire 15 for heating the catalyst wire 15, wherein a film-forming seed is generated by supplying a material gas to the heated catalyst wire 15, and a thin film is formed on the film-forming face Sa by depositing the film-forming seed on the film-forming face Sa. Also, there is provided a restriction wire 20 for imposing a restrictive magnetic field to the catalyst wire 15 by forming the restrictive magnetic field restricting the catalyst wire 15 along the film-forming Sa by acting on charged particles flowing in the catalyst wire 15. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009182150(A) 申请公布日期 2009.08.13
申请号 JP20080019784 申请日期 2008.01.30
申请人 ULVAC JAPAN LTD 发明人 OSONO SHUJI;NISHIKATA YASUSHI;ASARI SHIN;KIKUCHI MASASHI
分类号 H01L21/205;C23C16/44 主分类号 H01L21/205
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