发明名称 Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the same
摘要 The present invention relates to a photosensitive, aqueous alkaline solution-soluble polyimide resin (A) obtained by reacting a polyimide resin (a) which can be obtained by a tetracarboxylic acid dianhydride with a diamine compound with an energy ray-curing type aqueous alkaline solution-soluble resin (b); the resin has excellent photosensitivity obtained by mixing with a photopolymerization initiator and the like; the obtained cured products can be photosensitive resin compositions excellent in flexibility, low warping property, adhesion properties, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like.
申请公布号 US2009202793(A1) 申请公布日期 2009.08.13
申请号 US20070309059 申请日期 2007.07.09
申请人 NIPPON KAYAKU KABUSHIKI KAISHA 发明人 TANAKA RYUTARO;UCHIDA MAKOTO
分类号 B32B3/10;C08G73/10;G03F7/004;G03F7/039 主分类号 B32B3/10
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