| 摘要 |
A seamless hat and a method manufacturing in which cloth material is cut to form cut-out pieces having specific pattern outlines, then, after affixing superimposed edges of the cut-out pieces, then fixedly joined by ultrasonic or high frequency equipment is used to administer bonding processing. The current invention is not limited to the type of hat or specific type of materials. The preferred embodiment of the current invention involves producing highly ventilated piece of headwear. Additionally, said invention may be unnoticeably light weight to the wearer for entirely more comfortable experience.
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